Label.m M-Plex Bond Repairing Treatment Step 2 1000 ml

Améliorez votre routine de soins capillaires avec le traitement réparateur Label.m M-Plex Bond Étape 2. Appliquez une quantité généreuse sur les cheveux propres et humides, en insistant sur les zones abîmées. Laissez agir pendant 5 à 10 minutes, puis rincez abondamment. Pour un usage professionnel, personnalisez le traitement en fonction des besoins de vos cheveux.

Aqua (Water/Eau), Cetearyl Alcohol, Caprylic/Capric Triglyceride, Glycerin, Behentrimonium Chloride, Quaternium-91, Fragrance/Parfum, PPG-3 Benzyl Ether Myristate, Bis-PCA Dimethicone, Disodium PEG-12 Dimethicone Sulfosuccinate, Divinyldimethicone/Dimethicone Copolymer, Hydrolyzed Adansonia Digitata (Baobab) Extract, Hydrolyzed Linseed Seed, Aloe Barbadensis Leaf Juice, Camellia Sinensis (Green Tea) Leaf Extract, Aspalathus Linearis (Rooibos) Leaf Extract, Cocos Nucifera (Coconut) Liquid Endosperm, Lycium Barbarum (Goji) Fruit Extract, Olea Europaea (Olive) Fruit Oil, Crambe Abyssinica (Abyssinian) Seed Oil, C12-13 Pareth-23, C12-13 Pareth-3, Amodimethicone, C11-15 Pareth-7, Laureth-9, Cetrimonium Chloride, Trideceth-12, Vitis Vinifera (Grape) Seed Oil, Helianthus Annuus (Sunflower) Seed Oil, Glycine Soja (Soybean) Oil, Cetyl Esters, Panthenol, PEG 45M, Isododecane, Phenoxyethanol, Isopropyl Alcohol, Glycerin, Olea Europaea (Olive) Fruit Extract, Malpighia Glabra (Acerola) Fruit Extract, Persea Gratissima (Avocado) Oil, Polysilicone-15, Butylene Glycol, Helianthus Annuus (Sunflower) Seed Extract, Salvia Hispanica (Chia) Seed Extract, Saccharomyces Cerevisiae (Brewer's Yeast) Extract, Leuconostoc/Radish Root Ferment Filtrate, Maltodextrin, Guar Hydroxypropyltrimonium Chloride, Sodium Chloride, Aminomethyl Propanol, Benzoic Acid, Disodium EDTA, Benzyl Alcohol, Sodium Benzoate, Potassium Sorbate, Citric Acid, Ethylhexylglycerin, Linalool, Benzyl Benzoate, Limonene.